Abstract

To reduce geometrical errors in AM parts, use of inspection systems becomes essential. In this work, a non-contact inspection technique based on conoscopic holography (CH) for digitizing PLA parts produced by FFF on different colours and thicknesses is analysed. Tests were performed to check the quality of digitized point clouds, based on indicators related to the proportion of points captured and the quality of the signal acquired by the sensor. The thicknesses of deposited material were determined and compared to the nominal values. CH was revealed as a valid technology for digitizing and geometrical analysis of PLA parts.

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